At Improve 2025, NTT’s annual analysis and innovation summit held in San Francisco on April 9–10, Kazuhiro Gomi, President and CEO of NTT Analysis, took the stage to announce a new AI inference large-scale integration (LSI) chip that permits real-time processing of 4K video with low energy consumption. The announcement aligned with the summit’s theme, “Innovation for the New Actuality,” and marks a step ahead in edge computing and AI video evaluation.
“This chip runs AI inference on full 4K video with out decreasing the decision,” Gomi stated. “You’ll be able to mount it on a drone flying 500 ft within the air and nonetheless detect human exercise on the bottom—one thing beforehand unachievable with typical chips.”
Kazuhiro Gomi, President and CEO of NTT Analysis saying the AI Inference Chip for 4K video surveillance processing
The LSI is designed to be used in edge units and terminals the place energy constraints have historically restricted the deployment of AI processing for ultra-high-definition (UHD) video.
Present AI inference methods usually require the compression of ultra-high-definition video to allow real-time processing on power-limited units. NTT’s new chip addresses this problem by enabling high-resolution inference at 30 frames per second (fps) whereas consuming lower than 20 watts of energy.
One utility includes drone-mounted cameras utilized in infrastructure inspections and public security monitoring. With the brand new chip, drones can establish people or objects from altitudes as much as 150 meters (492 ft)—the authorized flight ceiling for drones in Japan. Beforehand, such duties had been restricted to decrease altitudes because of the computational and power calls for of high-resolution inference, limiting their operational scope to round 30 meters (98 ft).
The chip’s effectivity is pushed by an AI inference engine developed by NTT. The engine boosts computational efficiency via strategies equivalent to interframe correlation and dynamic bit-precision management, enabling real-time execution of object detection algorithms like YOLOv3 with out requiring GPU-level energy consumption.
To perform full 4K processing inside power constraints, the chip divides the high-resolution video into segments and applies algorithms that guarantee object continuity throughout phase boundaries. The system maintains detection accuracy whereas decreasing workload.
Privateness was additionally a key issue within the chip’s design. NTT Analysis has built-in encryption know-how that may obscure delicate particulars like faces on the level of seize. Licensed customers can later decrypt this data when vital, preserving privateness whereas nonetheless enabling post-event evaluation.
Industrial gross sales of the chip are scheduled to start by the tip of the 12 months via NTT Modern Gadgets, the corporate’s semiconductor division.
The chip was one of many key highlights introduced at Improve 2025, alongside different initiatives centered on advancing next-generation infrastructure. NTT researchers are additionally exploring the mixing of this LSI into the Modern Optical and Wi-fi Community (IOWN) Initiative. The aim is to leverage the high-speed, low-latency capabilities of the IOWN All-Photonics Community to assist scalable, energy-efficient data-centric infrastructure (DCI).
Moreover, NTT is collaborating with NTT DATA to discover how the chip’s capabilities may very well be enhanced utilizing Attribute-Primarily based Encryption (ABE) applied sciences. ABE offers fine-grained entry management, enabling safe information sharing that aligns with versatile coverage necessities and current system architectures.
In edge environments, the chip opens new prospects for real-time AI throughout industries equivalent to transportation, utilities, and public security.
With this new AI inference chip, NTT Analysis is pushing the boundaries of edge computing and real-time video evaluation—providing a highly effective device for next-generation imaging functions.
Filed in AI (Artificial Intelligence), Encryption, Ntt, Processors, Research and Semiconductors.
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